Yesterday AMD announced its upcoming AM5 platform powering its Ryzen 7000 series CPUs, along with three new chipsets featuring more I/O connectivity. The biggest surprise is AMD’s introduction of a multi-chip design for its flagship X670E and X670 chipset models. This isn’t something we’ve seen before on a consumer-focused platform, but AMD’s choice to go multi-chiplet on its flagship chipsets could pay off.
According to a report by Angstronomics.com, AMD’s multi-chip approach for X670 and X670E has similar advantages to AMD’s current chiplet architecture on Ryzen CPUs. With this approach, AMD can increase I/O expansion drastically while at the same time significantly reducing manufacturing costs. This would be impossible if AMD built single monolithic dies for X670 and X670E.
Read more @ Tom’s Hardware