Also , compared to the predecessor model “MPG X570 GAMING PRO CARBON WIFI” , the power supply circuit has changed from 10 + 2 phase to 14 + 2 phase , and the board is also server grade with a server grade 4-layer PCB to 2 ounce thick copper foil layer. Upgrade to 6-layer PCB . As a result, heat generation can be suppressed even under high load, and the stability of the system is also improved.
Read more @ GDM (Japanese)