June 17th, 2021 – GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the launch of the newest X570S AORUS series motherboards primed to unleash the potential of the recently released AMD Ryzen™ 5000 series desktop processors with enhanced DrMOS direct power design and 6 layers and above ultra cool PCB for higher stability. The whole series equip with a brand new passive chipset thermal design and up to four sets of high thermal efficiency armored PCIe 4.0 M.2 slots with M.2 Thermal Guard III, which ensures effective heat dissipation of full operation on chipsets and 7000MB/s high speed operating on NVMe SSDs without throttling by overheating. The brand new X570S series motherboards kick off the PCIe 4.0 era with extensive feature sets. The flagship X570S AORUS MASTER motherboard is fitted with a 16-phase direct digital power design for the more solid power management and optimized overclocking performance. With advanced heat dissipation technology of Fins-Array II Stacked Fins Heatsink, Direct Touch Heatpipe II and Smart Fan 6, GIGIABYTE X570S motherboards can maintain cool and high performance under high loading operation. Furthermore, GIGABYTE Active OC Tuner technology integrated in select motherboards to provide a more flexible performance improvement.
“AMD is excited for the launch of new and innovative X570 motherboards, bringing even more offerings to the AMD socket AM4 platform,” said Chris Kilburn, corporate vice president and general manager, client component business unit, AMD. “These new motherboards will continue to showcase the groundbreaking performance of the AMD Ryzen™ 5000 Series processors, maximizing the potential for enthusiasts, gamers, and content creators alike.”
The entire X570S lineup integrates a 2.5 GbE high speed LAN while select X570S AORUS motherboards feature WIFI 6 with blazing fast 2.4 Gbps connection speeds, and even WIFI 6E 802.11ax wireless network, as well as front USB 3.2 Type-C® interface for more convenient usage. Moreover, select X570S AORUS motherboards equip USB 3.2 Gen 2×2 Type-C® for a more speedy data transfer up to 20 Gbps. GIGABYTE also release X570S AERO G for creators. With built-in the same level power materials, thermal planning, high-speed network, and 4 sets of PCIe 4.0 M.2 interfaces as other X570S motherboards, X570S AERO G also features the VisionLINK function that is well-received by the creators to provide them a more effective transform from ideas to creation.
“Providing users with the best product has always been Gigabyte’s mission, while the top-quality AMD platform motherboards with excellent compatibility, high efficiency and low temperature demonstrates our strong strength in the development of AMD motherboards. “said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division. “ GIGABYTE’s X570S series motherboards are developed by gamers and professional designers who pursue performance, and are enhanced by the features of 16-phase direct digital power design, advanced VRM thermal design, silent cooling design without chipset fan, several PCIe 4.0 interfaces, blazing fast LAN, updated BIOS, and R&D’s adjustment. This series definitely impress the performance chaser by the performance and stability and become the perfect choice for high-end users who plans to assemble AMD platforms. ”
Read more @ GIGABYTE