..:: Intel Processor Numbering System – Hell Has Frozen Over…Again ::..
I had expected Intel to move over to a processor numbering system, although I actually expected it to happen a little sooner than it has. With the launch of these LGA 775 processors, Intel is moving over to their new numbering system. The main reason, or “straw that broke the camel’s back” that brought about this change of heart was the Pentium M. Due to the performance and success of this processor, Intel was forced to determine how to justify a consumer buying a 1.60GHz Pentium M over a 2.80GHz Pentium 4. No longer can a MHz rating determine the relative processor performance. The new number scheme for the desktop assigns 5xx values for the Pentium 4, and 3xx values for the Celeron version. The 3.60GHz “E” is now known as the 560, with each previous speed grade lowered by 10. The Extreme Edition CPU’s are still going on MHz ratings for now. Below is a breakdown of the Pentium 4 numbers.
Speed – Product Number
3.60GHz – 560
3.40GHz – 550
3.20GHz – 540
3.00GHz – 530
2.80GHz – 520
..:: TDP – A Step Back to Reality ::..
As we saw with the official TDP ratings for the 3.40E and 3.40C processors, the heat issues were ever present, and suffice to say, it wasn’t going to improve any time soon. The 3.40E was the first processor we had come across that was able to break the 100W thermal design power mark, a claim to fame that no desktop processor wants. As expected, with these new LGA 775 processors, the situation hasn’t improved on the TDP front. The 3.40EE boasts a TDP of 109.6W, while the 3.40E (550) and 3.60E (560) sport a TDP of 115.0W! The max current draw for the 3.40E and 3.60E processors is a massive 119 Amps, up 41 Amps from the 3.20 and below speed grades, and a VCore of 1.250V-1.400V. The 3.40EE has a max current draw of 83.9 Amps, with a VCore of 1.525V-1.600V. For a full breakdown of the specifications for each processor, take a quick look at the table above.
..:: Processor Physical Overview ::..
The processor itself is slightly larger than the Socket 478 Pentium 4’s, and also features a slightly modified heatspreader. The heatspreader on the Socket 478 implementation goes to roughly 1mm from the edge of the package, and then drops down to the surface. On the LGA Pentium 4’s, the heatspreader goes out a similar distance, although the outer edge is lowered down to allow for the outer casing that holds the processor in place once it is mounted. On the bottom of the package, we find all 775 of the gold contacts, along with the various resistors, and capacitors that are surface mounted underneath the processor die. This package looks quite similar to the 478 solution, only larger and pin-less.