The Socket 939 is oriented lengthwise from north to south, though it does not quite reach the top edge of the PCB. As this is the first Socket 939 motherboard we’ve had a chance to review, let’s take a quick look at the retention mechanism. This new mechanism for the 754 and 939 processors is similar to that which Intel uses, although MSI’s implementation only requires two screws on opposing sides of the processor. There is a brace plate on the back side of the PCB that MSI has attached to the board, presumably with a thermal material. This plate is difficult to remove, so if you’re planning on adding some upgraded cooling, be sure to take this fact into account.

     Located along the top edge of the PCB, we find the main three-pin fan power connector for the CPU fan. This area also houses the core voltage regulator chip, as well as several small capacitors. Along the right side of the processor socket, we find that this area of real estate is quite clean. The remaining area above the processor socket houses some of the other components and chips related to the core voltage power supply.

     The components that make up the core voltage power supply for the CPU are located in the typical position, along the rear of the motherboard between the I/O panel and the processor socket. One thing MSI has done for the K8T Neo2-FIR is to add three heatsinks to help cool off the MOSFETs. By removing heat at a faster rate from the MOSFETs, we can end up with a smoother power supply that is better for overall stability, and can also add some additional headroom for overclocking. From visual examination, we can also see that the K8T Neo2-FIR utilizes a three-phase power design. MSI has lined up several of the capacitors along the side of the Socket 939 retention mechanism which adds to the cleanliness of the motherboard design.